| 摘要 |
PROBLEM TO BE SOLVED: To carry out matching of data corresponding to minute changes in a pattern due to reasons of a mask manufacturing process, in carrying out defect inspection of the pattern by comparing pattern data developing design data with measurement data. SOLUTION: This device has a multi-level gradation pattern expansion circuit 78 for expanding to pattern data of multi-level gradation, and a resize circuit 77 for carrying out resize processing for the pattern data. This device compares the resize-processed data with measured data and detects defects. The resize circuit 77 is provided with pattern data inverting circuits 10, 14. Moreover, a maximum value detection circuit 11 is provided for detecting a maximum value in a specified area in the pattern data, and an oblique side detection circuit 12 is provided to recognize the shape of the pattern data. At the same time, a pattern data enlarging circuit 13 is provided to carry out resize processing. |
