Semiconductor device having the inner end of connector leads displaced onto the surface of semiconductor chip

摘要

A semiconductor device includes connector leads which have an offset portion supported by the primary surface of a semiconductor chip on which electronics circuitry is formed into an integrated circuit. The offset portion is disposed near the contact pads for connecting the electronics circuitry. The remaining portion of the connector leads far from the contact pads is spaced from the primary surface by an adhesive strip of electrically insulative material. Bonding wires connect the connector leads to the contact pads. The total thickness of the package is reduced to accomplish a thinner and flatter semiconductor device.