| 摘要 |
In a high-density mounting method for an electronic circuit board, a stud bump is formed on a connection terminal of a semiconductor chip. The semiconductor chip is buried in a printed circuit board such that the stud bump has a height almost equal to that of a surface of the printed circuit board. At least a surface of the printed circuit board where the semiconductor chip is buried is covered with a first insulating layer. A hole is formed in the first insulating layer by using a laser to expose the stud bump. A first wiring pattern is selectively formed on the first insulating layer, thereby connecting the first wiring pattern and the exposed stud bump to each other. A high-density mounting structure for an electronic circuit board is also disclosed.
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