发明名称 |
Heat sink for auxiliary circuit board |
摘要 |
The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is unshaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.
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申请公布号 |
US5875097(A) |
申请公布日期 |
1999.02.23 |
申请号 |
US19970871235 |
申请日期 |
1997.06.09 |
申请人 |
POWER TRENDS, INC. |
发明人 |
AMARO, MICHAEL;ASHDOWN, GLYNN RUSSELL;FERNANDEZ, CLAUDE |
分类号 |
H01L23/367;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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