发明名称 MOLDING, METHOD FOR MOLDING IT, AND MOLD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a method for molding a thin molding having a thickness of 0.1 to 1 mm to bring about a molding fault even by using normal thermoplastic resin. SOLUTION: The method for molding the molding uses first and second molds 10, 11, melted resin injecting unit 14 for injecting melted resin in a cavity 15, an insert 16 disposed at least one of the molds 10, 11 and manufactured by inorganic material having a thickness of 0.5 to 10 mm, elastic modulus of 0.8×10<6> kg/cm<2> or more and thermal conductivity of 0.2 to 2×10<-2> cal/ cm.sec.deg, and mold assembly for satisfying L<=kiαt0 <2> (L>=3), where t0 (unit: mm) denotes a distance of the cavity 15 when the mold is clamped, ki denotes fluid coefficient (1.5<=ki <=10),αdenotes flow index (40<=α<=800), and L (unit: mm) denotes a distance from part of the cavity 15 disposed at the farthest place from a melted resin injecting unit 14 to the unit 14, and comprises the step of injecting melted thermoplastic resin from the unit 14 in the cavity 15.
申请公布号 JPH1148290(A) 申请公布日期 1999.02.23
申请号 JP19970208987 申请日期 1997.08.04
申请人 MITSUBISHI ENG PLAST KK 发明人 TAWARA HISASHI;ITO TAKAYUKI
分类号 B29C45/26;B29C45/37;B29C45/56;B29C45/80;B29K101/12;(IPC1-7):B29C45/26 主分类号 B29C45/26
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