| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad hard to scar in polishing, and provide relatively high polishing rate. SOLUTION: In the case of polishing a plate glass 4, a polishing pad which has a melting point, of 160 deg.C or more, or a heat distortion temperature of 150 deg.C or more at 4.6 kg/cm<2> of load, which has a Young's modulus lower than 0.5 GPa, and comprising a polymer sheet 1 in which grooves of 0.5-5 mm width and lands are formed alternately on its surface is bonded to a surface plate 5 with a pressure sensitive adhesive double coated tape 6 to be used. |
