RESIN-SEALED SURFACE MOUNTING TYPE ELECTRONIC PARTS

摘要

Resin-sealed surface mounting type electronic parts which are formed in such a way that an electronic part element (5) is mounted on a resin-made wiring board (1) and a sealed area having a cavity housing the element (5) is formed by bonding a lid member to the board (1) so as to cover the element (5), and then side-face electrodes (21) are formed in through conductive grooves provided inside the bonding surface of the cap member on the board (1). Plated layers in the through conductive grooves have conductors (10 and 11) on the upper and lower surfaces of the board (1) each constituted of two or more kinds of metallic layers containing a plated gold layer (13) formed as the uppermost layer and a plated copper layer (12) and connected to the peripheral edges of the conductive grooves. On the upper conductor (10), however, only the plated copper layer (12) is formed and the other plated layers including the gold layer (13) are not formed on the conductor (10) so as to improve the reliability of the adhesion between the board (1) and cap member. Therefore, the reliability of the adhesion between the board (1) and the cap member for forming the sealed area having a cavity housing the element (5) is improved and the reliability of the airtight sealing of the element (5) is improved.