| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent formation of such improper soldering as solder ball, insufficient solder strength or offset position. SOLUTION: A semiconductor device 1 includes a metallic base 2, an insulating substrate 3 having upper and lower electrodes formed on upper and lower surfaces, a soldering film 5 disposed between the lower electrodes and the base 2, and semiconductor elements 6 provided on an upper surface of the substrate 3 and electrically connected to the upper electrodes. Provided on the soldering film 5 are electrically conductive bumps which secure a constant spacing between the substrate 3 and the base 2. |
