| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has nearly the same size as a semiconductor element has and, accordingly, can be sufficiently reduced in size and thickness and, at the same time, can be manufactured inexpensively. SOLUTION: A semiconductor device 30 is constituted by fixing a semiconductor element 32 to a semiconductor package 31. The package 31 is provided with a substrate 33 on which the element 32 is mounted and fixed, and a connection pattern 34. The substrate 33 has an opening 35 which is formed through the substrate 33. The element 32 is fixed to the substrate 33 in such a state that the element forming surface 32a of the element 32 is brought into contact with the substrate 33, and the electrode of the element 32 is fixed in such a state that the electrode 30 is faced to the opening 35. The electrode 38 of the element 32 is electrically connected to a connection pattern 34 through wires 39 passed through the opening 35. The inside of the opening 35 including the wires 39 is sealed with a resin. |
