| 摘要 |
PROBLEM TO BE SOLVED: To easily form a wiring part with high degrees of freedom through making a land small, by bonding at least one of short-circuit parts formed in an insulating layer to a conductor in a via hole part of a board. SOLUTION: A short-circuit part 33 is bonded to a via hole part 21 of a board 20 and/or a wiring part, and this short-circuit part 33 is connected to a connecting electrode 31 directly or via upper surface of a wiring part 32. Each of connecting electrodes 31 is connected electrically to a terminal electrode 61 via the short-circuit part 33, a lower surface of a wiring part 62 and a short- circuit part 23 on a board. The short-circuit parts 33, 63 can be provided by forming a drilled hole in an insulating layer 30, 60 and by forming a conductive body in it, and the depth of the drilled hole reaching a via hole part 21 on the board 20 and/or a wiring part and net penetrating through the board 20 is acceptable. Thereby, electrical connection between layers by the short circuit part 33, 63 can be made surely. |
