发明名称 ATMOSPHERIC PRESSURE CVD EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide an atmospheric pressure CVD equipment which is capable of preventing the generation of dust, and to avoid falling of a wafer pallet. SOLUTION: A silicon wafer is placed on a wafer pallet 4 which is fixedly fitted between a pair of slide blocks 20, 20 and a pair of tap plates 21, 21 which are, respectively, arranged in face-to-face relation. The silicon wafer is conveyed to a reactive gas ejection system, by permitting the slide blocks 20, 20 to be moved in accordance with rotation of a pair of two-row endless conveyor chains 15, 15. Then, temperature is raised by means of hot plates each provided inside the conveyor chains 15, 15 to form a film on the silicon wafer. A bridge 30 is provided between the pair of slide blocks 20, 20 to keep the distance therebetween and to connect the blocks 20, 20 with each other.</p>
申请公布号 JPH1140552(A) 申请公布日期 1999.02.12
申请号 JP19970197591 申请日期 1997.07.23
申请人 SHARP CORP 发明人 MIYAKI YUKIO
分类号 B65G49/07;H01L21/205;H01L21/31;H01L21/68;H01L21/683;(IPC1-7):H01L21/31 主分类号 B65G49/07
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