| 摘要 |
<p>The apparatus includes a plate (10) which is configured to carry an electronic component (11) and which has a thermally-conductive porous medium (16) disposed therein. The porous medium is sized to receive a fluid (45). When an electronic component is disposed on the plate and a fluid passes through the thermally-conductive porous medium, at least a portion of the fluid boils and heat is removed from the electronic component by conduction and phase change effects.</p> |
