发明名称 LOW TEMPERATURE LAMINATION OF WOOD
摘要 Storage stable and nonblocking adhesive films and processes for adhering decorative overlays such as wood veneers, high pressure laminates, and thermoplastic overlays to wood substrates. The adhesive films contain a base adhesive comprising an ethylene polymer having carboxylic acid functionality or an ethylene polymer capable of being modified to have carboxylic acid functionality. Preferred adhesive films further comprise a crosslinking agent such as an epoxy. The adhesive films may further comprise compatibilizers and/or curing agents. The adhesive films allow decorative overlays to be laminated at lower temperatures than prior art adhesive systems and demonstrate superior melt strength. The adhesive films and processes of the present invention can be advantageously utilized in applications such as furniture laminates, cabinet door laminates, flooring laminates, residential and architectural door skin laminates, store fixtures, high pressure laminates for countertops, veneer laminated sheet, and plywood fabrication.
申请公布号 WO9906210(A1) 申请公布日期 1999.02.11
申请号 WO1998US15870 申请日期 1998.07.30
申请人 THE DOW CHEMICAL COMPANY;KELCH, ROBERT, H.;CURTIN, PAUL, M.;DUBENSKY, ELLEN, M.;READ, MICHAEL, D.;HARELLE, LUDOVIC 发明人 KELCH, ROBERT, H.;CURTIN, PAUL, M.;DUBENSKY, ELLEN, M.;READ, MICHAEL, D.;HARELLE, LUDOVIC
分类号 B32B21/08;B44C1/17;B44C5/04;C08L23/08;C08L63/00;C08L77/00;C09J123/08;C09J151/00;C09J151/06 主分类号 B32B21/08
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