| 摘要 |
<p>PROBLEM TO BE SOLVED: To avoid deteriorating a semiconductor element below bonding pads, by providing bridge across an opening formed at an island, and wire-bonding thin metal wires by the ball-bonding for connection on the semiconductor chip side and stitch-bonding for connection on the bridge side. SOLUTION: An island between semiconductor chips 50, 51 has an opening 56 across which required no. of island-like bridges 57 are provided and wire- bonded to bonding pads 53 through thin metal wires, such that the pads 53 at the semiconductor chips 50, 51 are ball-bonded and those at the bridges 57 are stitch-bonded. This suppresses the stress exerted on the chips 50, 51 below the pads 53 and hence suppresses the deterioration of the semiconductor elements below the pads 53.</p> |
