| 摘要 |
A wire bonding head supported for movement upwardly and downwardly having a wire bonding tool connected to an ultrasonic driver in order to sonically bond a wire to an underlying electrical component. The wire is fed to the bonding tool, and fed broken and clamped by a linkage connected to at least one stepper motor. A processing unit is mounted on the bonding head for controlling the clamping, feeding, and breaking of the wire.
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