| 摘要 |
PROBLEM TO BE SOLVED: To improve the transferability and the surface properties of a mold by a low blowing pressure without heating the mold up to an elevated temperature by a method wherein an insulating layer, which is made of a material having a specified thermal conductivity and has a specified thickness, is imbedded in the porous plate-like portion of a porous mold. SOLUTION: At a porous plate-like portion 2 mounted onto the surface of a mold main body 1, a porous electroformed layer 2p, on the surface side opposite to a cavity surface of which an insulating layer 2q is coated. Thus, a porous electroformed layer with the insulating layer consisting of the cavity surface-the insulating layer portion (2p+2q) of the porous plate-like portion 2 is formed. Next, on the surface of the insulating layer, an electrically conductive film is formed and further a porous electroformed layer 2r is formed on the insulating layer 2q, resulting in producing the porous plate-like portion 2 (2p+2q+2r). As a result, an air stagnant between the cavity surface of a mold and a parison is easily removed, resulting in increasing the degree of adhesion between them. Further, by making the lowering of temperature smaller, the transferability of the mold is improved. |
