Magnetic head/silicon chip integration method

摘要

A method of integrating slider/head assemblies with silicon chips. The method facilitates the integration of silicon chips containing desirable circuits such as electrostatic discharge protection with slider/head designs such that the slider/head design may be selected independently of the type of silicon chip as long as compatible dimensions are used for each. First a bar of N slider/head assemblies is formed. A bar of N silicon chips is formed and then coupled to the bar of N slider/head assemblies to form an integrated bar of N slider/head/silicon chip units. Leads between the silicon chips and the slider/head assemblies are established. Finally, the integrated bar of N slider/head/silicon chip units is diced into N individual slider/head/silicon chip units. The method also includes the step of lapping the bar of N slider/head assemblies to form magnetic head air bearing surfaces and machining the bar of N slider/head assemblies to decrease the weight of the N slider/head assemblies.