发明名称 |
Method and apparatus for processing samples |
摘要 |
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.
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申请公布号 |
US5868854(A) |
申请公布日期 |
1999.02.09 |
申请号 |
US19920987171 |
申请日期 |
1992.12.08 |
申请人 |
HITACHI, LTD. |
发明人 |
KOJIMA, MASAYUKI;TORII, YOSHIMI;HUNABASHI, MICHIMASA;SUKO, KAZUYUKI;YAMADA, TAKASHI;KUROIWA, KEIZO;NOJIRI, KAZUO;KAWASAKI, YOSHINAO;SATO, YOSHIAKI;FUKUYAMA, RYOOJI;KAWAHARA, HIRONOBU |
分类号 |
C23F4/00;H01J37/18;H01L21/00;H01L21/3213;H01L21/461;H01L21/677;(IPC1-7):B08B6/00;H01L21/302 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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