| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a copper alloy material for electronic equipment excellent in lead formability by etching and in which the sizes of crystal grains and precipitate in the matrix are fine. SOLUTION: In the method for producing a copper alloy material for electronic equipment such as a lead frame in which a copper alloy for precipitation hardening is subjected to solution treatment and aging treatment, the copper alloy contains at least Ni and P, the copper alloy is subjected to the solution treatment at 700 to 850 deg.C, thereafter, the copper alloy is subjected to primary cold working at >=60% draft, subsequently, the copper alloy is subjected to primary aging treatment at 400 to 500 deg.C for 0.5 to 5 hr, thereafter, the copper alloy is again subjected to secondary cold working at <=50% draft and, the copper alloy is subsequently subjected to secondary aging-treatment at 350 to 450 deg.C for 0.5 to 5 hr. |
