| 摘要 |
<p>The invention concerns a method for producing microstructures or nanostructures on a support, comprising the following steps: contacting one surface of a first wafer (1) in crystalline material with a surface of a second wafer (2) in crystalline material, so that the two crystalline lattices of said surfaces have at least one misalignment parameter for forming a crystalline fault network (6) and/or a stress network within the crystalline zone (8) extending on either side of the interface of the two wafers, at least one of said networks defining a microstructure or a nanostructure; thinning one (1) of the two wafers to expose the fault network and/or the stress network on a support (10) constituted by the other wafer.</p> |
