| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead structure for an electronic part which can shorten an electric signal flow path and reduce contact resistance. SOLUTION: In the structure of a lead 4 electrically connected to the surface of a substrate 6 and mounted on the side of an electronic part 1, the electronic part 1 is directly connected to the surface of the substrate 6 by an external force applied to the electronic part 1. According to this lead structure, a contact pin can be eliminated and hence an electric signal flow path can be shortened and the lead 4 is electrically connected to the surface of the substrate at one point therebetween, which can reduce contact resistance.</p> |
