CERAMIC-METAL COMPOSITE CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a ceramic-metal composite circuit board which can efficiently avoid the heat generated from semiconductor elements. SOLUTION: The void ratio at the junction interface of semiconductor mounting parts on a metal plate bonded to a main surface of a ceramic board is set to 1.5% or less and diameter thereof is set to 0.7 mm or less. The board uses an alumina board having a surface roughness of 15μm/20 mm or less. The active metal method provides, under the binder removing condition of 600 deg.C×4 Hr or 650 deg.C×2 Hr or more, a void ratio of 1.5% or less and diameter of 0.7 mm or less.