| 摘要 |
The invention relates to a card inlay consisting of a substrate (1) which has a first and a second surface, said surfaces facing each other. A semi-conductor chip (2) is positioned on the substrate (1) by means of a chip carrier (3). A conductor layout (10) is applied on the opposite side by means of printing. According to the invention, a connection (11) is also provided, said connection filling a contact gap (9) in the substrate (1), and at the same time creating an electrically conductive contact with the chip carrier connection (8). |
