| 摘要 |
A method for mounting a semiconductor chip on a circuit board comprises the steps of pre-baking the circuit board to remove nonvolatile ingredients of epoxy resin, such as cyclohexane, in the circuit board at temperature above 170 DEG C. for above 10 minutes, and thermosetting the epoxy resin by applying a thrust force for thrusting the semiconductor chip against the circuit board at a maximum thrust force of 30 gf/bump. |
