发明名称 THERMOSETTING RESIN COMPOSITION FOR MULTILAYERED PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain the subject resin composition, having sufficient adhesion to a conductor without using a rubber component in an insulating layer, having high heat resistance and excellent in dielectric characteristics by including an epoxy resin containing a specific amount of a methane skeleton-containing epoxy resin, an epoxy resin curing agent, a filler and an organic solvent therein. SOLUTION: This composition is obtained by including an epoxy resin containing a methane skeleton-containing epoxy resin (preferably a diglycidyl ether of terpene diphenol or terpene di-2,6-xylenol) in an amount of >=15 pts.wt. in 100 pts.wt. epoxy resin, an epoxy resin curing agent containing a novolak resin (e.g. p-octylphenolic novolak resin) and a polyhydric phenol compound [e.g. 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane], a filler (preferably calcium carbonate in an amount of <=50 pts. based on 100 pts.wt. epoxy resin) and an organic solvent (e.g. carbitol in an amount of 5-25 pts.wt. based on 100 pts.wt. epoxy resin).
申请公布号 JPH1121429(A) 申请公布日期 1999.01.26
申请号 JP19970173936 申请日期 1997.06.30
申请人 MITSUI CHEM INC 发明人 TAKAHASHI KATSUYA;SUZUKI TERUFUMI;YASUDA KIYOMI
分类号 C08K3/26;C08G59/20;C08G59/40;C08G59/62;C08L63/00;H05K3/46;(IPC1-7):C08L63/00 主分类号 C08K3/26
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