| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive which can be dispensed in a stable amount regardless of a change in ambient temperature by incorporating a specified amount of a heat storage material component in an adhesive. SOLUTION: This adhesive is prepared by incorporating 5-50 pts.wt. heat storage material component having a glass transition point and a softening point at least either of which is 20-60 deg.C to 100 pts.wt. adhesive. The heat storage material used is e.g. a solid epoxy resin powder having a softening point of 59 deg.C or a paraffin wax having a melting point of 45-60 deg.C. When the heat storage is softened or molten, it removes heat from the adhesive to inhibit it from becoming excessively flowable due to the otherwise risen ambient temperature. To mount an electronic component, this adhesive is applied to a predetermined position on a circuit board at 20-60 deg.C, the component is mounted on the applied adhesive, and the adhesive is cured by heating, Next, after a flux is applied to the circuit board, the board is immersed in molten solder to solder the component and the board together. |
