| 摘要 |
PROBLEM TO BE SOLVED: To prevent adhesive agent from overflowing into a transfer guide hold by a method, wherein a lead terminal is fixed with a tape slightly wider than a contacting surface between a transfer belt and the lead terminal sticking its tip into the transfer belt at a point above a transfer guide hole bored in the transfer belt. SOLUTION: Two lead terminals 1, formed of copper wires plated with solder or the like, are soldered to an electronic part 2 such as a surge absorber or the like. The tips of the lead terminals 1 are processed like needles. The pointed tips are inserted into a through-hole bored in a transfer belt 4 of craft paper above a transfer guide hole provided to the transfer belt 4. Furthermore, the tips are bonded and fixed to the transfer belt 4 at a spot located above the transfer guide hole 5 with a tape 3. By this setup adhesive agent applied to the tape 3 is prevented from overflowing into the transfer guide hole 5 and adhering around a transfer pin when the electronic component 2 is mounted, and the electronic component 2 is surely transferred, eliminating transfer instability. |
