| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layered wiring board for mounting of a semiconductor element, in which an adhesion sheet is disposed between a base wiring substrate and a bored wiring substrate to form a laminate, the laminate is disposed between end plates and then hot-pressed, thereby suppressing flow-out of resin from the adhesion sheet. SOLUTION: In the method for manufacturing a multi-layered wiring board for mounting of a semiconductor element, in which a base wiring substrate 11, bored wiring substrates 13 having cavity hole 12 and an adhesion sheet 15 disposed therebetween are stacked and hot-pressed to form a laminate, the adhesion sheet 15 is 0% in its resin flow-out percentage at 170 deg.C and 1-5% at 200 deg.C, and the laminate is hot-pressed and molded at a temperature of 180-250 deg.C under a pressure of 10-20 Mpa.</p> |
