| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor device superior in the fluidity and reliability with a short hardening time, by containing an oxetane compd. as a resin sealing compsn. SOLUTION: To relax the thermal stress due to the thermal expansion coefficient difference between a chip 1 and a circuit board 2 during the flip chip connection and for the insulation seal, a resin compd. 4 is filled between the chip 1 and the board 2. The semiconductor sealing compsn. 4 contains an oxetane compd., having at least one oxetane ring per molecule e.g. 1,4-bis[(3- methyl-3-oxetanilemethoxy)methyl]benzene, thereby obtaining a semiconductor sealing resin compsn. having a high fluidity and quick hardening property chargeable in fine gaps with holding a heat resistance and reliability. Using the compsn., a semiconductor device suited for a high density mounting is obtd.</p> |
