| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce generation of flaws in the steps of assembling a solid state image pickup device by preventing attachment of abatements and preventing damages during a dicing step and reducing, to a full extent, such steps that a pickup surface is exposed in an atmosphere so as to diminish attachment of dust. SOLUTION: A protection sheet 1 is sticked on the surface of a wafer 2a having a solid state image pickup element 2, and the wafer 2a is sticked on a sheet 3 for wafer mount. After dicing, UV is irradiated on both surfaces of the wafer 2a so that the solid state image pickup element 2, the protection sheet 1 and the wafer mounting sheet 3 can be separated from each other. Thereafter, the solid state image pickup element 2 and the protection sheet 1 are subjected to die mounting in a given region of a printed circuit board 5. After the mount has been cured, the protection sheet 1 in whole is separated from the solid state image pickup element 2 by using a separation sheet 7.</p> |
