| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board in which an electronic-part mounting surface can have a high flatness with less warpage of the board. SOLUTION: A wiring board 1 includes a rectangular frame member 2 of ceramic having a rectangular cavity 6 thereinside and also includes a bottom member 20 of ceramic which forms a bottom of the cavity 6 and has a flat upper face 26 previously polished. The upper face (mounting face) 26 of the bottom member 20 for mounting an IC chip or the like thereon is positioned within an opening 10 in the bottom of the cavity 6. The bottom member 20 is fixedly mounted on the frame member 2 with brazing material disposed therebetween at a periphery 27 of a main body 22 of the bottom member via a brazing material 28. Since the frame 2 and the bottom members 20 have thermal expansion coefficients which are identical or close each other, such a deformation as a warpage in the entire wiring board 1 can be prevented. |
