| 摘要 |
<p>A flexible printed wiring board 10 comprises an element mounting part 60A and 60B where circuit elements are mounted and a bending part 70 to be bent around the bending axis, and an inner conductor layer 34U' is formed on the inside of the board, wherein element mounting part conductor layers 30U' and 33L are formed on both surfaces at outer layers 17Uand 13 of the wiring board, respectively, on the element mounting part 60A and 60B, and on the bending part 70, a bending part conductor layer 36U' is formed only on the surface on the outer side that faces the exterior when the wiring board is bent. As a result, the crack resistance is improved and the line impedance of the signal conductor pattern 36U', which is formed in the bending part 70, is stabilized by reducing the number of layer in the bending part 70 than that of in the element mounting part 60A and 60B.</p> |
