LAMINATED PLASTIC AND PLATE MATERIAL MANUFACTURING PROCESS

摘要

FIELD: printed-circuit boards and multichip modules. SUBSTANCE: nonconducting (dielectric) layer reinforced by unidirectional fibers which are not transformed into fluid is manufactured as follows: adhesive coating is applied to one or two sides of at least part of mentioned unidirectional layers; layers having any proportion of adhesive-coated parts are stacked so that at least one binder layer is provided between each pair of layers having practically same quantity of material of equal thickness and similar composition arranged in practically perpendicular intersecting directions; piled up UD layers are joined together by activation of binder layers. Material thus manufactured has low temperature coefficient and is noted for low cost and low layer-to- layer stresses. EFFECT: improved strength of material. 19 cl