发明名称 INJECTION MOLDING METHOD FOR THERMOPLASTIC RESIN
摘要 PROBLEM TO BE SOLVED: To manufacture a void-free molded product without lowering productivity by molding in the relation between the average weight of grains of thermoplastic resin and the containing ratio of linked grains being within the range of satisfying a given formula. SOLUTION: Molding is carried out in the range of satisfying a formula I of O<=W×T<=8.0 in the relationship of containing ratio T (weight %) between the average weight W (mg/grain) of grains of a linked body having the weight of approximately 1.5-2.5 times the average weight of normal unlinked grains of thermoplastic resin. Preferably molding is carried out within the range of satisfying a formula II of O<=W×T<=6.0. when the product of the average weight W (mg/grain) per grain of thermoplastic resin and the containing ratio T (weight %) of the linking grains is beyond the range of formula I, the generation of voids in a molding product becomes great.
申请公布号 JPH1110671(A) 申请公布日期 1999.01.19
申请号 JP19970171817 申请日期 1997.06.27
申请人 MITSUBISHI CHEM CORP 发明人 KAWAKAMI KAZUMI;NODA KENJI
分类号 B29B9/06;B29C45/00;B29C45/50;B29K67/00;(IPC1-7):B29C45/00 主分类号 B29B9/06
代理机构 代理人
主权项
地址