发明名称 Process for removing seams in tungsten plugs
摘要 A method for fabricating seamless, tungsten filled, small diameter contact holes, has been developed. The process features initially creating a tungsten plug, in the small diameter contact hole, and filling or repairing, seams or voids in the tungsten plug, with an additional layer of selectively deposited tungsten.
申请公布号 US5861671(A) 申请公布日期 1999.01.19
申请号 US19970892219 申请日期 1997.07.14
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 TSAI, NUN-SIAN;HUANG, YUNG-SHENG
分类号 H01L21/768;H01L23/485;H01L23/532;(IPC1-7):H01L23/48;H01L29/40 主分类号 H01L21/768
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