发明名称 |
Process for removing seams in tungsten plugs |
摘要 |
A method for fabricating seamless, tungsten filled, small diameter contact holes, has been developed. The process features initially creating a tungsten plug, in the small diameter contact hole, and filling or repairing, seams or voids in the tungsten plug, with an additional layer of selectively deposited tungsten.
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申请公布号 |
US5861671(A) |
申请公布日期 |
1999.01.19 |
申请号 |
US19970892219 |
申请日期 |
1997.07.14 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSAI, NUN-SIAN;HUANG, YUNG-SHENG |
分类号 |
H01L21/768;H01L23/485;H01L23/532;(IPC1-7):H01L23/48;H01L29/40 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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