| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which does not produce rotational moment of the polished surface of a semiconductor wafer and keeps parallelism with high accuracy to polish a work even if a friction force is produced. SOLUTION: A polishing device has holding means for holding a work 25 to be polished and polishes the work 25 held by the holding means by pressing it on a surface plate. The holding means has a first holding member 12, a second holding member 24 opposed to the first holding member 12 and for holding the work 25, an intermediate member 16 provided between the first and second members 12, 24, one or more set of link mechanism 14a, 14b for joining the first holding member 12 to the intermediate member 16, and one or more set of link mechanism 20a, 20b for joining the second holding member 24 to the intermediate member 16, and each link mechanism is arranged in the direction opposite to each other and the turning center of each link mechanism is one point on the grinding surface of the work 25 to be polished. |
