发明名称 |
Polishing apparatus and polishing method using the same |
摘要 |
A polishing apparatus and a polishing method using the apparatus in which an elastic portion is interposed between a polishing table and a polishing cloth, whereby the contacting state between the face of the polishing cloth and a face of a sample to be polished is made uniform and the flatness of the sample is improved. A polishing apparatus and a polishing method using the apparatus in which a second elastic body having on a sample-contacting face resin pellets and/or polishing particles is used in a polishing cloth, whereby the degree of the polishing on a face of a sample to be polished is uniformalized in a macroscopic view point and the flatness is improved in a microscopic view point. A polishing apparatus and a polishing method using the apparatus in which a second elastic body having convex portions, concave portions or groove portions formed on a sample-contacting face is used in a polishing cloth, whereby the degree of the polishing on a face of a sample to be polished is uniformalized in a macroscopic view point and the flatness is improved in a microscopic view point. A polishing apparatus and a polishing method using the apparatus in which an elastic portion is interposed between a polishing table and a polishing cloth, and the second elastic body is used in the polishing cloth.
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申请公布号 |
US5860851(A) |
申请公布日期 |
1999.01.19 |
申请号 |
US19960730656 |
申请日期 |
1996.10.11 |
申请人 |
SUMITOMO METAL INDUSTRIES, LTD. |
发明人 |
BEPPU, TOSHIYASU;WATANABE, JUNJI |
分类号 |
B24B29/00;B24B13/01;B24B37/005;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24B37/26;B24B41/06;(IPC1-7):B24B7/22 |
主分类号 |
B24B29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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