发明名称 Polishing apparatus and polishing method using the same
摘要 A polishing apparatus and a polishing method using the apparatus in which an elastic portion is interposed between a polishing table and a polishing cloth, whereby the contacting state between the face of the polishing cloth and a face of a sample to be polished is made uniform and the flatness of the sample is improved. A polishing apparatus and a polishing method using the apparatus in which a second elastic body having on a sample-contacting face resin pellets and/or polishing particles is used in a polishing cloth, whereby the degree of the polishing on a face of a sample to be polished is uniformalized in a macroscopic view point and the flatness is improved in a microscopic view point. A polishing apparatus and a polishing method using the apparatus in which a second elastic body having convex portions, concave portions or groove portions formed on a sample-contacting face is used in a polishing cloth, whereby the degree of the polishing on a face of a sample to be polished is uniformalized in a macroscopic view point and the flatness is improved in a microscopic view point. A polishing apparatus and a polishing method using the apparatus in which an elastic portion is interposed between a polishing table and a polishing cloth, and the second elastic body is used in the polishing cloth.
申请公布号 US5860851(A) 申请公布日期 1999.01.19
申请号 US19960730656 申请日期 1996.10.11
申请人 SUMITOMO METAL INDUSTRIES, LTD. 发明人 BEPPU, TOSHIYASU;WATANABE, JUNJI
分类号 B24B29/00;B24B13/01;B24B37/005;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24B37/26;B24B41/06;(IPC1-7):B24B7/22 主分类号 B24B29/00
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