发明名称 ELECTROCHEMICAL VAPOR DEPOSITION DEVICE, AND SOLID ELECTROLYTE FILM FORMING METHOD USING IT
摘要 PROBLEM TO BE SOLVED: To form a solid electrolyte film of the uniform composition on an inner circumferential surface of an air electrode support pipe. SOLUTION: In an electrochemical vapor deposition device, the raw vapor deposition material powder is vaporized at the high-temperature atmosphere in a vaporization chamber 37, and the raw material vapor 25 is introduced into the vapor deposition base material 23 in a reaction chamber 21 from the vaporization chamber 37 through a raw material vapor feed pipe 38 to achieve the electrochemical vapor deposition. When the raw material vapor 25 is introduced in the vapor deposition base material 23 through the raw material vapor feed pipe 38, the raw material vapor is discharged inside the vapor deposition base material through a large number of discharge holes formed all over the pipe wall of the raw material vapor feed pipe, and the vapor concentration is approximately uniform in upper and lower parts inside the vapor deposition base material to enable the electrochemical vapor deposition, and as a result, the solid electrochemical film of the constant composition can be formed over the whole inner circumferential surface of the vapor deposition base material.
申请公布号 JPH1112737(A) 申请公布日期 1999.01.19
申请号 JP19970165902 申请日期 1997.06.23
申请人 KANSAI ELECTRIC POWER CO INC:THE;FUJIKURA LTD 发明人 TAKEUCHI SHINJI;FUJITA JUNICHI;KANEDA NAMIKO;ONO MIKIYUKI;MOCHIZUKI MASATAKA;NAGATA MASAKATSU;IWAZAWA TSUTOMU;TAKAOKA MICHIO
分类号 C23C16/40;C23C16/44;C23C16/455;H01M8/02;H01M8/12 主分类号 C23C16/40
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