EPOXY RESIN COMPOSITIONS FOR ENCAPSULATING SEMICONDUCTORS, AND SEMICONDUCTOR DEVICES

摘要

Epoxy resin compositions for encapsulating semiconductors, which are free of halogen compounds and antimony compounds and excellent in flame retardancy, high-temperature storability and reliability on moisture resistance; and semiconductor devices. The compositions are characterized by comprising (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) zinc molybdate as indispensable components; and the devices are characterized by being encapsulated with the above compositions.