Reworkable circuit board assembly including a flip chip

摘要

A reworkable circuit board assembly (10) including a flip chip (40) adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly (10) includes a heat sink (20) having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of the flip chip (40). It also includes a deformable circuit board (30) having a first side and a second side, wherein the first side is secured to a side of the heat sink (20) in thermal communication therewith. The flip chip (40) is bonded to the second side of the deformable circuit board (30) without underfill or with weak bond strength underfill to facilitate removal of the flip chip (40) in the event of a rework.