发明名称 |
Method and apparatus for plasma processing a workpiece in an enveloping plasma |
摘要 |
A plasma heating apparatus for heating a workpiece includes a chamber of sufficient size to receive a workpiece therein and a source of a reduced gas pressure within the chamber of from about 0.01 to about 100 millitorr. The plasma heating apparatus further includes a plasma source of an enveloping plasma. Optionally, a workpiece voltage may be applied between the workpiece and the wall of the chamber, and a source of a reactive gas can be provided to backfill the chamber, and radiant heaters can be provided to independently heat portions of the workpiece. In operation, the plasma source produces a plasma that surrounds and heats the workpiece. The plasma and the heating of the workpiece are tailored to achieve controllably uniform or nonuniform heat treatment and/or surface treatment of the workpiece. The apparatus can be used to heat treat the workpiece in vacuum, or a reactive gas such as a gaseous source of nitrogen, carbon, or boron can be backfilled into the chamber to alter the surface chemistry of the workpiece.
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申请公布号 |
US5859404(A) |
申请公布日期 |
1999.01.12 |
申请号 |
US19950543860 |
申请日期 |
1995.10.12 |
申请人 |
HUGHES ELECTRONICS CORPORATION;GENERAL MOTORS CORPORATION |
发明人 |
WEI, RONGHUA R.;MATOSSIAN, JESSE N.;MIKULA, PETER;CLARK, DEBORAH |
分类号 |
H05H1/46;C23C8/36;C23C16/50;H01J37/32;(IPC1-7):B23K10/00 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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