| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing an intermediate of ball grid array package and an electronic component by which the component can be made large sized and damages to a substrate during manufacture are reduced. SOLUTION: A resin substrate 10 made of a single synthetic resin is provided with solder balls 11 and with several identical sections, corresponding to single ball grid array packages. Each of several ceramic substrates is provided with connecting terminals 21 for connection with a device 31 and is jointed to each section of the resin substrate. The bottom of the ceramic substrate 20 and the top of the resin substrate are electrically connected through a conductor, such as solder 25, and the space between them is filled with underfill 27 made of a synthetic resin. The underfill 27 exhibits a coefficient of thermal expansion which is intermediate between those of the ceramic substrate 20 and the resin substrate 10.</p> |
