| 摘要 |
PROBLEM TO BE SOLVED: To enhance reliability for connection of stacked semiconductor devices. SOLUTION: A through-hole is cut at such point as separated into almost halves, so a plurality of recessed parts 2 whose cross sections are almost semicircular are provided on a side end surface of a substrate 1, while an outer lead 3 is formed at each of the recessed parts 2. A counterbore part 4 is formed on the one side surface of the substrate 1, where an opening part 5 opened to both surfaces of the substrate 1 is provided. A circuit 6 connected to the outer lead 3 is formed on the surface of the substrate 1, on the side opposite to a surface where the counterbore part 4 is provided. A semiconductor element 7 is mounted on the counterbore part 4, and a wire 8 is bonded between the semiconductor element 7 and the circuit 6 through the opening part 5. While are semiconductor element 7 mounted in the counterbore part 4 does not protrude above the surface of the substrate 1, the connection between the outer loads 3 provided on the substrate 1, with the substrate 1 being directly jointed, allows the electrically connection of a semiconductor device which is loaded. |
