| 摘要 |
<p>PROBLEM TO BE SOLVED: To form bumps on the correct electrode pad positions by a method wherein the recessed surface central sections to be the electrode pads are formed from the surface of a wiring substrate to the base material side inside so as to insert the bar type bump members into the recessed electrode pads. SOLUTION: The non-through holes in a specific depth are bored from a surface 5A on the bump connection side to the base material side inside so as to form a through hole plating layers 4. Thus, recessed electrode pads 6 in the surface central sections are formed in a surface outer layer conductor 5 on the surface connection side. Next, a surface outer layer conductor 3 of the electronic components loading surface and both sides of a wiring substrate 1 are coated with solder resist 7 excluding the required connecting lands of the surface outer layer body 5 on the bump connection side and the electrode pads 6 having recessed sections. Furthermore, the inside of the electrode pads 6 having recessed sections formed on the bump connection side of the wiring substrate 1 is coated or filled up with a conductive paste 8 so as to form the bumps.</p> |
