发明名称
摘要 PURPOSE:To provide a circuit board in which an electric conduction between a wiring conductor and a circuit conductor is improved and which can be covered therewith with excellent adhesive properties. CONSTITUTION:A circuit board in which an outer surface of an insulating base 1 having wiring conductors 2 made of at least one type of tungsten, molybdenum, manganese, is so covered with circuit conductors 4 made of copper as to be partly connected to the conductors 2, an intermediate metal layer 3 containing 0.1-40wt.%. of tungsten and 0.01-30wt.% of phosphorus in nickel, is interposed in a contact between the conductor 2 and the conductor 4. The board is covered with the conductors 2, 3 with excellent adhesive properties by the layer 3, and the electric conduction between the conductors 2 and 3 is extremely excellent.
申请公布号 JP2842707(B2) 申请公布日期 1999.01.06
申请号 JP19910144771 申请日期 1991.06.17
申请人 KYOSERA KK 发明人 OBATA SOICHI;YAMANOGUCHI MANABU;AIHARA KENICHI
分类号 H05K1/09;H05K3/24;H05K3/46;(IPC1-7):H05K1/09 主分类号 H05K1/09
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