| 摘要 |
PROBLEM TO BE SOLVED: To prevent the breaking of a wire in a second bonding section. SOLUTION: A semiconductor device is provided with a sealing body 2 made of an insulating resin, a supporting plate 4 positioned in the sealing body 2, a semiconductor chip 7 fixed on the supporting plate 4, leads 3 extended to the outside of the sealing body 2 around the supporting plate 4 from the inside of the body 2, and conductive wires 10 bonded between first bonding sections at the electrode sections of the chip 7 and second bonding sections at the front- end sections of the leads 3 by nail-head wire bonding. In the leads 3 in the sealing body 2, the wire-connecting surfaces 6 of the leads 3 connected to the wires 10 are protruded towards the wire connecting surfaces 6 from the surfaces of the leads except the connecting surfaces 6. The front-end sections of the leads 3 are bent toward the wire-connecting surfaces 6 in stepwise states and the surfaces of the protruded sections formed, when the front-end sections of the leads 3 are bent constituting the wire-connecting surfaces 6. The supporting plate 4 is set at a lower level than the surfaces of the leads 3, except the wire- connecting surfaces 6 in the sealing body 2. |
