发明名称 Method of fabricating a thin film conductor coil assembly
摘要 A thin film helical conductor coil assembly includes an electrically-nonconducting ceramic substrate having a substantially planar surface and separated first and second magnetic elements which mutually bound a volume of the ceramic substrate. The thin film conductor coil assembly also includes a thin film magnetic core, which magnetically connects the first magnetic element to the second magnetic element. The thin film magnetic core, which overlies the substantially planar surface of the ceramic substrate, is constructed from a compliant electroplated magnetic material. The thin film conductor coil assembly further includes an electroplated thin film helical coil which traverses about the thin film magnetic core and forms a conductive path from a first terminal to a second terminal.
申请公布号 US5853558(A) 申请公布日期 1998.12.29
申请号 US19970789913 申请日期 1997.01.31
申请人 AIWA RESEARCH AND DEVELOPMENT INC. 发明人 GRAY, G. ROBERT;MALHOTRA, ARUN
分类号 G11B5/31;G11B5/105;G11B5/127;G11B5/17;H01F41/04;(IPC1-7):C25D5/02 主分类号 G11B5/31
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