| 摘要 |
PROBLEM TO BE SOLVED: To prevent a module device from being damaged due to the thermal fatigue by providing pressing members using elastic insulators for pressing a semiconductor pellet at specified pressure in a case and external connection terminals having lower ends connected to part of a metal plate pattern on the front surface of a circuit board. SOLUTION: External connection terminals 17 pierce part of a cover 16 and have lower ends brazed to part of a steel plate pattern 10b on a circuit board 10 and upper ends bent along the top surface of the cover 16. Pressing members 18 are provided for partly pressing the circuit board 10 at specified pressure in a case 14 and composed of elastic insulators having comb-like projections 18a tapered toward the tops on the upper surfaces and protrusions 18b on the lower surfaces. The cover 16 is fitted into the opening upper face of a tubular part of the case 14 so as to press the pressing members 18, this preventing the module device from being damaged due to the thermal fatigue of the bond zones of the circuit board 10. |
