| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the burden to workers at the time of manufacturing a wafer holding tool and, at the same time, to reduce the manufacturing cost of the tool by piling up wafer supporting plates in many stages by slipping the wafer supporting plates on posts erected on a base to prescribed positions. SOLUTION: A wafer holding tool is assembled in such a way that, after a required number of SiC posts 13 is erected on an SiC base 12 and a lower spacer 15 is slipped on the posts 13 fixed on the base 12 to a prescribed position, many wafer supporting plates 16 are slipped on the posts 13 to prescribed positions between the lower and upper ends of the posts 13. After the plates 16 are put on the posts 13 to the upper ends of the posts, 13, an SiC upper spacer 17 is slipped on the posts 13 to a prescribed position and an SiC roof plate 24 is put on the upper ends of the posts 13. Since the wafer holding tool is assembled in the above-mentioned way, the labor required for manufacturing the tool can be reduced remarkably, because, even when part of the tool is broken, the tool can be repaired by exchanging the broken part, and, at the same time, the manufacturing cost of the tool can be reduced.</p> |
