发明名称 WAFER PROBER
摘要 <p>PROBLEM TO BE SOLVED: To mount a probe card on a mother board under good parallelism between them by providing electrically conductive contacts at least at two symmetrical positions in the contact surface between the probe card and the mother board and checkining continuity between these electrically conductive contacts. SOLUTION: Electrically conductive contacts 11 consisting of small pieces of a gold foil and a copper plate, etc., are mounted at two symmetrical positions in the peripheral part of the top surface of a card base 3 of a probe card 1 respectively. On the other hand, electrically conductive contacts 12 are mounted at the positions on the bottom surface of a connector ring 8 of the mother board facing the above-mentioned two positions. Therefore, in the case where the card 1 and the board 2 are mounted together under good parallelism between them when the card 1 is mounted on the board 2, the electrically conductive contacts 11, 12 are brought into contact at the above-mentioned two positions and into electrical continuity. By checking this continuity by a simple circuit tester, etc., via notch parts 13, it is confirmed that whether the card 1 is mounted on the board 2 under good parallel relationship between them or not.</p>
申请公布号 JPH10335397(A) 申请公布日期 1998.12.18
申请号 JP19970155796 申请日期 1997.05.29
申请人 NEW JAPAN RADIO CO LTD 发明人 NIIJIMA NOBUYOSHI
分类号 G01R1/073;G01R31/28;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R1/073
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